EQUIPMENT

Capabilities and Features:

• Dual 1 MP resolution GigE CCD cameras with continuous zoom optics for better alignment accuracy
• Objective separation 44-200mm
• Optical magnification 70x – 400x
• Large optics Y travel for flat alignment
• Enhanced digital image capture and blended image overlay resulting in better front to backside overlay accuracy
• Computer controlled illumination for more repeatable alignment
• Auto-alignment utilizing the latest pattern recognition technology from Cognex
• Includes CD Measurement capability
• Backside alignment with optical backside magnification 180x, digital zoom and motorized auto-focus
• Auto Wedge Effect compensation including 3 pt wedge- effect leveling and automated gap setting
• Joystick control of alignment tooling and optics

Capabilities and Features:

• FEP Teflon® chamber liner
• 12.5" (318 mm) I.D. bowl-shaped process chamber
• Up to Ø8" (Ø200 mm) wafer or 7" (178 mm) square substrate capability
• Speed: to 12K RPM, Acceleration: up to 13K RPM (in 1 RPM increments)
• Time: 1 second to 99 minutes 59.9 seconds in 0.1 second increments
• Vacuum chuck — Ø100mm (Ø3.9") for Ø100mm through Ø200mm substrates
• Micro Fragment Adapter for 3mm - 10mm Fragments
• Mid Size Fragment Adapter for 5mm - 25mm Fragments
• Alignment Tool for 125 mm, 150 mm, and 200 mm SEMI wafers

Capabilities and Features:

• 8’’x8’’ surface area
• Up to 450^oC
• Each program can be 10 steps
• Repeat any program 1–98 times automatically. Infinite repeats settable
• Programmable and non-programmable operation
• Platinum RTD temperature measurement for ±1% accuracy
• Temperature ramping for exact heating and cooling rates
• PID temperature control to 1°C on plate surface or solution with accessory probe
• Stir up to 2 liters of aqueous solutions from 100–1500 rpm (HS40 and HS40A)
• Timer goes up to 99 hours, 59 minutes, 59 seconds with user settable Auto-Off

Capabilities and Features:

• 400W 50KHz Continuously Variable Power Supply
• Two 0-25cc/min Rotometers with Precision Needle Valves
• Stores One Recipe for Automatic Process Sequencing
• Chamber is made of 6061-T6 Aluminum
• Chamber size is 7.5”Wx8.75”Dx3.5”H

Capabilities and Features:

• 7L volume (30L x 15W x 15D cm)
• Frequency : 35kHz +3.5/－5

Capabilities and Features:

• 200 mm motorized stage
• 150 mm x 178 mm X-Y range of motion
• Highest vertical range at 1200 μm
• Low force measurements at 0.03 to 15 mg
• Step height repeatability of 5 Å on a 1 μm step
• High resolution 5 MP color camera with 4x digital zoom
• Software features: Keystone correction, arc correction, sequencing with deskew, and automated stitching

• 180cm wide operation space
• UV free environment
• Integrated facilities (DI water, N2 and CDA)
• Exhausted and laminar flow working environment
• Better than ISO 5 (CLASS 100) conditions in the working space

Capabilities and Features:

• Vacuum loadlocked system with compatible robotic arm
• Including an ICP source for improved efficiency
• 600W, 13.56MHz RF generator
• Substrate biasing
• Fully programmable and automated process
• Auto and manual tuning of the RF matching network
• Seamless transfer to PECVD chamber without losing vacuum

Capabilities and Features:

• Vacuum loadlocked system with compatible robotic arm
• 300 W, 350kHz power supply
• Fully programmable and automated process
• Electrode heating
• Seamless transfer to RIE chamber without losing vacuum

Deposition Sources : with its 500mm x 500mm baseplate, it could accommodate up 6 sources and a wide variety of PVD processes with the chamber height of 500mm

Sputtering : RF, DC, and reactive sputtering available

Substrate Fixturing and Masking:

• Vacuum Control - can be configured for high vaccum (HV) or ultra-high vaccum (UHV) utilizing a turbo pump.
• Heated, Cooled, & Biased Stages -  LN2/GN2 cooling to -170° C, Heating to 900° V, Auto-calibration via AERES software, RF or DC stage biasing

Deposition Sources : with its 400mm x 400mm baseplate, it could accommodate up 6 sources and a wide variety of PVD processes with the chamber height of 500mm

Electron Beam Evaporation : Wide range of source options, Programmable sweep controller with recipe storage, Torque sensing crucible indexer detects pocket jams.

Substrate Fixturing and Masking:

• Vacuum Control - can be configured for high vaccum (HV) or ultra-high vaccum (UHV) utilizing a turbo pump.
• Variable Angle Stages - comfortably coat 3D features, create complex Nano-structures -95° to  95° tilt with continuous rotation
• Heated, Cooled, & Biased Stages -  LN2/GN2 cooling to -170° C, Heating to 900° V, Auto-calibration via AERES software, RF or DC stage biasing
• Planetary & Dome Fixturing - domed substrate carrier for lift-off and batch process, Planetary motion & flip fixturing are available

The compact RP325+LXT line. 660 x 660 mm - 26” x 26”

Capabilities and Features of Laser Plotter :

• Data input formats: RS274D, RS274X, DPF and EIE RPL.
• Plot queues can be setup with more than 15 different plot parameters.
• Temperature and humidity recorded for each plot
• Compatible with most film processors
• Overall accuracy of ± 10 µm (± 0.4 mil) and repeatability of (±  3 µm (± 0.12 mil)

Exposing unit for the Laser Plotter :

• Max Exposure area : 660 x 660 mm (26“ x 26“)
• Compatible film lengths: 18“, 20“, 24“, 25.5“ and 26“
• Compatible film width : Any width larger than 300 mm (12“) up to 520 mm (20,5’’)
• Film thickness  :  0.18 mm (7 mils)
• Exposure device: One 512 beam SDH3 head with light intensity equalization
• Light Wavelength : Monochromatic red light, 647 nm

The Hope/Carnfeldt EG 750 PCB processor

Capabilities and Features of Development Processor :

• Inlet width : 75 cm/ 29''
• Rack length dev. : 32 cm / 12.6"
• Developing time min.-max. : 20 – 80 sec.
• Speed at 30 sec. dev. time  : 64 cm/min.
• Max. film length : 5 m / 16.4 ft.
• Min. film size : 18 x 10 cm / 7 x 4"
• Dev./fix./wash temperature range : 20 - 45°C / 68 – 113°F .

Location: Bergeron Building RM324

Capabilities and Features of Keyence VHX-970F Digital Microscope :

• 20x – 2000x magnification
• Bright Field, Dark Field, Polarized, Mixed Lighting
• Motorized z-stage (49 mm movement range)
• Auto-focus
• 3D profiling